Pseudomorphic HEMT Technology and Applications (Nato Science

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Language: English

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The wafers are heated to an operating temperature of about 1500-2200°F (816-1205°C), and the dopant chemical is carried in on an inert gas. High grade P-N-P assembly is not possible. 8. The area between each row of pins is perfectly spaced to allow DIP ICs to straddle the center area of a breadboard. Although, in 1967 it was reported in "Electronics" that half of Philco's production of MOS integrated circuits was for Victor calculators, and it was also due to deliver circuits to a Japanese calculator maker, there were still great problems and the development contract was cancelled in 1968.

Pages: 350

Publisher: Springer; 1996 edition (February 29, 1996)

ISBN: 0792339150

Electronic Circuit Guidebook, Vol 2: IC Timers

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